https://www.geeknetic.es/Noticia/36291/Los-chips-NVIDIA-Blackwell-fabricados-por-TSMC-en-territorio-americana-tienen-que-volver-a-Taiwan-para-su-empacado.html

Among the plans of the United States is independence as for the advanced technology silicon manufacturing. Something that TSMC has achieved on US soil at its fab21 plant in Arizona. Just a few days ago, TSMC manufactured its first NVIDIA chip based on the blackwell architecturean important milestone for advanced technology manufacturing in the USA, that has gaps.

TSMC already manufactures NVIDIA Blackwell chips in the USA, but with exceptions

Blackwell-based GPUs not only benefit from a TSMC advanced node, but also employ a advanced packaging system. Specifically, these GPUs use the packaging system CoWoS (Chip on Wafer on Sustrate) for which they will have to return to TSMC facilities in Taiwan. This breaks the independence for the manufacturing of advanced nodes in the United States, since they have to travel to other TSMC facilities in local territory to complete the packaging process next to the HBM3e memory stack.

Blackwell chips made in the USA have to return to Taiwan for CoWoS packaging

To solve these problems, TSMC seems to will have the help of Amkor Technologywhich has begun building a facility for carry out this type of packaging on US soil. The initial investment is 7,000 million dollars, with which would avoid having to return Blackwell GPUs (or any other that employs CoWoS) to TSMC facilities in Taiwan. A solution that, when available, If it can be called 100% “made in the USA” when it is completed around mid-2027.