AMD will manufacture the I/O chips for its next EPYC processors with the 4 Nm node of Samsung

Last month we knew the AMD intentions to manufacture your new and next Zen 6 nuclei under a 3 nm nodewhich will offer higher performance and lower consumption. As always, AMD would have chosen TSMC and its N3E node for the manufacture of these new nuclei. There was also talk of a new chip for I/O that would offer notable improvements, and that It would also be manufactured by TSMC under its N4C node. It seems that These plans have changed And this I/O tile will be manufactured by Samsung.

As usual, AMD manufactures its entire processors in TSMC, something that will change in the future. According to The Bell, this I/O chip what will be for their AMD EPYC servers processorsunder this most advanced casting node you can Get improvements to the future. Some improvements that go through reduce consumption From this chip, which together with this new construction can add Compatible DDR memory controllers with higher frequencies.

At the moment there has only been talk of an I/O chip For next generation EPYC serversbut it is not known if you can take advantage of this production to also add this chip for its Ryzen processors in this 4nm node of Samsung.