The novelties of G.skill in the Computex 2025: DDR5-10934 memories, 64GB CAMM2 modules to 10,000 mt/s and much more

G.Skill in the Computex 2025

During this computer 2025 of Taipei, in Taiwan, G.Skill has deployed a great stand in which we have been able to know its new high performance memories and see live of what they are capable.

Models running at deviabated speeds in a stable manner and with conventional refrigerations, kits with capabilities that reached 512 GB of RAM, new 64 GB CAMM2 modules, all kinds of memory configurations for AMD and Intel, Overclock And much more, we have been able to see from the hand of the company

DDR5-10934 with the G.Skill Trident Z5 Neox RGB modules.

Without a doubt, the main protagonist of the event has been the live demonstration of a system with DDR5 memory with two modules TRIDS Z5 NEOX RGB 24GB endowed with selected chips SK Hynix DDR5 with those that G.Skill He has shown what they are capable.

These modules were working stable to some impressive 10,934 mt/s, No need for any type of special refrigeration system for memoirs.

The team in which this feat has been achieved has been an Asus Rog Maximus Z890 Apex motherboard together with the Intel Core Ultra 9 285K processor, achieving stable operation with raids Cl 68-128-128-256 in CR2.

All this on a conventional computer mounted on a Lian Li motherboard and with a liquid cooling system for the CPU. At no time has it been necessary to apply extreme cooling systems, not even placing a fan directly to the RAM modules.

In addition, these TRIDS Z55 NEOX RGB Kits also integrate an AMD Expo profile to function at 10,600 mt/s directly, without complicated configurations or manual overclock.

512 GB of RAM with Overclock stable in the R-DIMM Modules of G.Skill

Another of the surprises that G.Skill showed in his stand of the computex 2025 were his R-DIMM modules For workstations and professional users. Usually, this type of formats do not usually be seen with overclock, much less if we talk about kits with a capacity of nothing more and nothing less than 512 GB of DDR5 memory.

To achieve this, a whopping 8 G.Skill memory modules with chips have been used SK Hynix high density to reach 64 GB per module.

If you have ever performed Overclock to the memoirs, you may already know that, the greater the amount of memory and, above all, of modules, it is more complicated to reach high speeds. However, despite those 8 modules of 64 GB each, for that huge total of 512 GB, we have been able to see these memories running to 6,600mt/s in a stable way with latencies of CL42-54-54-105 in CR1.

These modules have been placed on an ASUS Pro WS WRX90E-SAGE BASE BASE WITH THE AMD RYZEN THREADRIPPER PRO 7985WX PROCESSOR OF 62 Nuclei and 128 Threads In a conventional box without extreme refrigerations.

Similarly, the company has shown another configuration with modules for work stations running at DDR5-6400 with a total capacity of 384 GB formed by 8 modules of 48 GB each. On this occasion for the Intel platform with an XEON W9-34754X processor and a Gigabyte W790 AI Top.

A single 64 GB module in CAMM2 format reaching DDR5-10000

G.Skill already opted last year for the CAMM2 format, a new module technology that connects directly to the motherboard by a multiple piners system with which greater efficiency in space is achieved by having a compact format, speed and bandwidth.

In this computer 2025 they have brought one of their most advanced modules with SK Hynix chips. It is a CAMM2 module of memory capable of operating at DDR5-1000 with a capacity of no less than 64 GB.

We have been able to work on an ASUS ROG Maximus Z890 Hero motherboard with an Intel Core Ultra 7 265K at that stable speed and without extra refrigeration. In fact, this module being CAMM2 does not even dissipate.

Additionally, the company has also shown modules in new generation CSO-DIMM format. They are characterized by integrating the CKD directly into the module as its desktop equivalents, but in a SO-DIMM module for laptops or mini PCs. On this occasion the chips used were Samsung.

The two CSO-DIMM modules of 64 GB each, with a total of 128 GB of RAM, reached a speed of DDR5-7200 with CL52-52-52 latencies.

High capacity memories with ultra low latency Cl26, Cl28 and CL34

Not everything is pure speed, latency in RAM modules is also very important and that takes special relevance today with applications that require increasingly low latencies.

Thinking about these environments, G.Skill has shown memory modules DDR5 of “ultra low latency”. We have been able to see, for example, its modules of 48 GB DDR5-6000 with a latency of only Cl26 running in a 192 GB kit (4 modules of 48 GB). They did it under a MSI MAG B850m Mortar Wifi motherboard with an AMD Ryzen 9900X processor.

Increasing speed to DDR5-6400 They have also shown low latency modules with Cl28 In the same capacity, that is, 192 GB of RAM distributed in 4 modules of 48 GB under a Gigabyte Z870E Aorus Master with another Ryzen 9 9900X.

Finally, climbing up to DDR5-8400, the low latency modules of G.Skill got a Cl32 latency in a 32 GB kit formed by two 16 GB modules on an ASUS Rog M Aximus Z890 Apex motherboard with an Intel Core Ultra 9 285K.

Overlock in high capacity kits

G.Skill also showed us high capacity kits, formed by modules up to 64 GB each, capable of reaching speeds DDR5-7500 with CL38-52-52 latencies. These speeds were stable even in configurations with the 4 dimm modules occupied in a total of 256 GB of Memorira Ram.

On this occasion, the team on which these speeds were achieved was based on an ASUS Rog Crosshair X870E Hero motherboard with an AMD Ryzen 7 9800x3D processor and a Custom Liquid cooling system of Bitspower liquid cooling that did not affect memories, only the CPU.

These speeds were also achieved in a team with a MSI meg x870e Godlike with an AMD Ryzen 9 9900X, making it clear that their Ram memories are Stable at high speed both on the Intel and AMD platform.