Gigabyte presents this COMPUTEX 2026 its AORUS X870E Infinity Next board with 64 phases and 3D printed metal heatsinks

Gigabyte presents this COMPUTEX 2026 its AORUS X870E Infinity Next board with 64 phases and 3D printed metal heatsinks

During this COMPUTEX 2026 Gigabyte has shown us its new high-end motherboards, boards that belong to the series Infinity in commemoration of his 40th anniversary. Under its gaming brand, AORUSthe manufacturer has presented two new models with chipset X870 and X870E for AMD processors, and with a clear orientation towards its top of the range Ryzen 9 9950X3D. Both models focus on offering technology X3D Turbo 2.0 that thanks to AI, better performance is offered in these processors with technology AMD 3D V-Cache in each CCD.

X3D Turbo Mode 2.0 uses AI to optimize Ryzen X3D processors

Gigabyte has presented two models of the series Infinitythe AORUS X870 Infinity and the AORUS X870E Infinity Next. The first is aimed at offering low latency with RAM, and the second for extreme cooling with a great capacity for energy delivery.

Both have the technology X3D Turbo Mode 2.0this has a dedicated chip that monitors the performance of the system at all times. Combined with a dedicated motor, which has been properly trained with precise data, it dynamically overclocks for these types of tasks. Each processor obtains the best performance, even adapting to different types of tasks such as gaming, content creation or high computing.

Geeknetic Gigabyte presents this COMPUTEX 2026 its AORUS X870E Infinity Next board with 64 phases and 3D printed metal heatsinks 2

The X870E Infinity Next is committed to extreme cooling and enormous energy capacity

If you’re looking for great power delivery and better cooling, Gigabyte has the AORUS X870E Infinity Next. This board combines aerospace technology with a design worthy of data centers with the most resistant thermal materials and metal 3D printing technology.

For SSD disks, the heatsink has been incorporated M.2 AI Gyroidonly possible thanks to 3D printing, with a 40% more contact areaa vapor chamber also 3D printed, and a panel-structured rear cooling plate.

Geeknetic Gigabyte presents this COMPUTEX 2026 its AORUS X870E Infinity Next board with 64 phases and 3D printed metal heatsinks 3

In terms of energy, this board has 64 phases and technology present in data centers such as Quad OptiCMOS. With this feeding system you can offer up to 5,120 amps of current.

The AORUS X870 Infinity reduces latency and reaches speeds of up to 11,400 MT/s

If you are looking for a board to connect low latency memory, the X870 Infinity It can be your choice. Designed to reduce latency with memory, it is capable of reducing it up to CL24 and reach speeds of 11,400 MT/s. This represents up to a 20% more speed with low latency compared to the usual platform values X870.