Xiaomi unveils its XRING 03 SoC with ARM C1 and LPDDR6 cores
Xiaomi has revealed the specifications of its new high-end processor, the XRING O3. It is a SoC manufactured in 3 nanometers from TSMC (N3P node), with which it manages to integrate 24,000 million transistors in an area of 133 mm² compared to 109 mm² of the previous generation.
Xiaomi has been based on the platform ARM Lumex CSS; Therefore, it has already taken ARM cores and designs as a basis to create this processor. The company has opted for the use of high-performance cores, leaving aside the more modest C1-Nano cores. Therefore, we only have cores with architectures ARM C1-Ultra, C1-Premium and C1-Pro in a distribution of 10 total cores, but divided into three blocks or clusters: two ARM C1-Ultra main cores capable of reaching 4.35 GHz, four C1-Premium cores running at 3.68 GHz and four C1-Pro cores at 3.15 GHz. All of them have access to a 16 MB shared SLC cache.
G2-Ultra NX GPU with 16 cores and LPDDR6 memory at 10,667 Mbps
For the GPU, Xiaomi integrates the 16-core G2-Ultra NX. According to its own data, it promises up to 85% more graphic performance than previous generations, 182% more in ray racing and 64% less energy consumption compared to its predecessor.
In addition, the
The chip also integrates a fifth-generation image processor (ISP) with support for sensors of up to 432 megapixels with 24-bit color depth and H.266 (VVC) hardware decoding.
It will be necessary to see if this XRING O3 reaches the international market or remains a rarity for China. The Xiaomi 18 Fold will be the brand’s first smartphone to integrate it, and it is expected to reach the international market, so, unless the company launches it with different SoCs depending on the market, as Samsung does, we could see it in our country.
On the other hand, the company also plans to put it together with the XRING O100, a dedicated AI accelerator, in a “mini PC” type device called Xiaomi AI Cube Prototype.
