Samsung and Qualcomm develop organic bridges for 2.1D packaging as an alternative to Intel’s EMIB technology

Samsung and Qualcomm They have been collaborating for more than a year to develop a system of 2.1D packaging based on organic bridges (Organic Bridge) that allows several chips to communicate within the same package in processors intended for data centers and artificial intelligence.

Both companies seek to achieve a cheaper solution than technology EMIB that uses Intel.

Instead of manufacturing that “bridge” as a tiny chip on a conventional wafer, as Intel does, Samsung and Qualcomm’s technology uses organic materials similar to those found in a conventional PCB, such as organic polymers, to interconnect several chips.

A cheaper alternative to Intel’s EMIB technology

technology uses a FC-BGA substrate forming a matrix of small “balls” with small holes to which these organic bridges are connected. The tests are using bridges manufactured by Samsung itself, as well as others manufactured by third parties, to test the viability of separate manufactures.

Both companies hope to create bridges with between 5 and 7 layers RDLwith tracks and separations of 1.5 to 2 micrometersways of 4 to 5 micrometers and with which to achieve connections with a density of between 500 and 1,000 lines per square millimeter between each chip.

This technology is expected to be integrated into future Qualcomm server processors and allows them to reduce costs by not having to use common “interposer” technologies, while also avoiding paying patents to Intel. However, it will not be an exclusive technology and can also be used in third-party chips manufactured at Samsung facilities.