FSP shows us its new air dissipators for CPUS up to 300 w

Together with its Liquid AIO refrigerations that we already review here: new liquid refrigerations of FSP with screens in the block, FSP has also taught us in the computex 2025 of Taipei its novelties for the market of traditional refrigerations by air for CPU.

The most striking model is the FSP MP9-B, A double tower dissipator with two integrated fans, designed for high performance systems. It has a height of 16.5 cm and the two fans are 140 mm, creating a large dissipator.

The base is traveled by 6 6 mm copper heatpipes that carry heat to the two black aluminum fins towers from a polished base. In addition, at the top it has a magnetic plaque system to cover it and leave a uniform finish.

He FSP MP9-B It has a decent design to leave space for RAM modules of a certain height. It is compatible with current AMD AM5 and AM4 sockets, in addition to the Intel LGA 1200, 1700 and 1851.

Its cooling capacity reaches 300W.

On the other hand, the FSP MP7P It is a model that also incorporates a double tower design with a double 140 mm fan, and you can even add one more on the other side. In this case, magnetic housing and panels are dispensed with.

We also have its 6 6 mm copper heatpipes on a smooth base and a 300 W cooling capacity.

Finally, the FSP ND-B It is a more compact model, with a single fan and a tower design. The fan is 120 mm long x wide and PWM control.

On this occasion we have four copper heatpipes and a striking upper panel that shows the temperature and rotation speed.

It is compatible with the same sockets as the largest model, and capable of refrigerating up to 240 W.