Intel Foundry separates in two: a new advanced packaging division is born led by the former CEO of SK hynix

Intel has modified the internal operating structure of its chip manufacturing division, Intel Foundry. The reason given by the company to justify the decision is related to seeking to accelerate the development of its packaging technologies for AI chips and high-performance computing. Until now, these operations were integrated with the rest of the division’s manufacturing processes.

With this move, an independent division dedicated to advanced packaging emerges that will be led by Seok-Hee Leeformer CEO of companies such as SK hynix and that he has been hired by Intel for this task. Seok-Hee Lee will take over as executive vice president of Intel Foundry and will be just below CEO Lip-Bu Tan.

The new division will be responsible for developing and implementing advanced packaging processes in chips manufactured by Intel Foundry

Under this position, he will be in charge of coordinating the development of back-end technology, systems integration and the final manufacturing of advanced chips. This includes the development and launch of advanced packaging technologies such as EMIB-T to interconnect modular components into next-generation chips.

This reorganization divides Intel’s foundry roadmap into two distinct blocks. While Lee will take care of everything related to packaging and integration, Naga Chandrasekaran will remain as executive vice president at the head of the front-end processes related to the development and launch of new nodes Intel 14A and the current Intel 18A-P.

Seok-Hee Lee was already part of Intel’s engineering team before his time at SK Hynix, and will now help the company overcome the current bottleneck caused by advanced packaging systems in the manufacture of new high-performance chips.