The Intel 18A-PT process with Foveros Direct 3D will allow to create Intel “X3D” processors

Intel’s new CEO, Lip Bu-Tan, has shown in its own “Intel Foundry Direct 2025” event, a “road map” updated from the company’s plans for the launch of its next manufacturing processes.

In general, the vast majority of processes that have already announced in the previous Roadmap of February of last 2024 are maintained, some with delays already known, such as the expected Intel 18a That, at that time, it was expected by 2024 and finally delayed for this year 2025.

Intel 18A-PT will arrive in 2028 with support for Direct 3D Foveros, allowing Intel to create packed cache processors like the AMD X3D

The most striking novelties are the existence of a new process Intel 18A-PT, which is nothing more than an expansion of the Intel 18A-P high performance (delayed until 2026) to adapt it to the 3D Foveros Direct Stacked technology. It will arrive throughout the year 2028 and will allow the stack of different Modules Intel 18A vertically.

This technology It will allow Intel to offer an alternative to technologies such as the 3D V-Caché de AMD with its own manufacturing process and without depending on TSMC.

On the other hand, Intel has confirmed that his nodes Intel 14a and Intel 14a-e They will use High-Na EUV technology, something that could give the company an advantage over TSMC, which will not use this type of machines.