The new AMD 900 chipsets will arrive with native support for CUDIMM and CAMM
Just yesterday BIOSTAR announced its news for this upcoming COMPUTEX 2026, and among all these news, the launch of new motherboards for next generation AMD processors. Briefly with this announcement, everything pointed to the new motherboards with 900 series chipsetperhaps the top of the range X970 for more powerful processors. But as he tells us MEGAsizeGPU on his X/Twitter account, this new chipset may be the same as the 800 and 600 series, although with some interesting changes.
AMD 900 Series chipset could reuse Promontory 21 silicon
The information from the well-known leaker says that this 900 series chipset may be based on the same silicon Promontory 21 designed by ASMedia. But obviously this new chipset will have differences with the previous ones, such as new functions at the BIOS level that will complement perfectly with the next generation processors that AMD has prepared. Additionally, this 900 chipset series will also feature additional features and native support for CUDIMM and CAMM memory.
The future AMD Ryzen Olympic Ridge will arrive with improvements in memory and latency
The new processors AMD Olympic Ridge will have a new I/O chip made of 4 nanometers. The introduced memory controller will offer higher frequencies, lower latency and support for CUDIMM and CAMM. AMD is also preparing EXPO 1.2which will offer improvements in the memory overclocking with just a few mouse clicks.
A silicon that may be the same, but that offers interesting improvements at the BIOS level and advanced memory supportallowing to improve the speed and latency with the new ones Next-gen AMD Ryzen.
