TSMC expects to manufacture 80,000 chips wafers at 2 nanometers at the end of the year

As we already knew, TSMC has everything ready for the start of large -scale manufacturing of chips based on their 2 nanometers “TSMC N2“During the second half of this year.

Currently in the testing phase after an overtaking of the company’s plans, the development this process seems to be “full -to -clothed wind”, and the latest leaked information suggests that, although the Kaohsiung plant and Baoshan’s plant are initially manufacturing 5,000 wafers per month each, They will be able to increase up to a combined total of 50,000 at the end of the year.

However, this figure could increase to 80,000 units per month If the company continues to improve its technologies. At the moment, TSMC has not revealed any of these numbers officially, but taking into account the great demand that is expected for the 2 nanometers process, and the good performance data or “Yield” that they would be achieved, it would not be unreasonable to think about those figures.

Its main competitor, Samsung, does not seem that it has managed to improve the performance of 30% viable chips per wafer in its 2 nanometers process, so we possibly see a TSMC domain and higher prices for the following generations of chips.

We will also have to see how Intel is going with its Intel 18A process, in theory capable of competing with the N2 of TSMC.