Sandisk and SK Hynix join forces to work in a flash memory with more capacity than HBM, focused on the most demanding tasks of AI
Sandisk and SK Hynix have decided to take a joint step towards the future of artificial intelligence oriented memory. Both companies have signed a collaboration agreement with their eyes on a new technology called high bandwidth flash (HBF)a system that promises to revolutionize the way in which data loads are handled in demanding environments.
The intention is clear: work hand in hand to establish a common specification that Feel the foundations for this new flash memorydefine the necessary technical requirements and, at the same time, foster a technological ecosystem around HBF. It is a strategic movement that seeks to respond to the growing performance needs in AI projects, both in large data centers and in EDGE scenarios.
An answer to the growing demand for memory in AI
Alper Ilkbaharone of Sandisk’s technical managers explained it to: “With this collaboration we address a critical need in the industry: to have scalable memories that are up to what the AI applications demand”. And it’s not for less. Current models are not only huge, but they need to move huge amounts of data in a very short time. And for that, traditional memory solutions are no longer enough.
For their part, from SK Hynix also see this alliance as a key step to move towards more powerful computer science. He Dr. Hyun Ahnits development director, pointed out that standardizing this new technology will not only facilitate its adoption, but will also help release all the potential of AI and future data -based workloads.
What makes this new memory different?
What they propose with HBF is quite ambitious: to offer a bandwidth similar to that of HBM memories (High Bandwidth Memory), but with a capacity that would multiply between 8 and 16 times that of the latterand all that at a competitive price. The balance between capacity, speed and cost is just what many companies are looking for their AI infrastructure.
This new memory is based on the BICS SANDISK TECHNOLOGY and in an own assembly technique called CBA. Both companies have been working side by development for more than a year, together with other important actors in the sector.
Recognition, dates and what comes
The advance has already begun to receive recognition. In fact, the proposal of HBF was awarded at the Future Of Memory and Storage 2025 event as the most innovative technology of the year. And although there is still a way to go, Sandisk has already set date on the calendar: The first samples will be ready in the second half of 2026and it is expected that in 2027 there are already devices with this technology in operation, especially in the inference tasks of AI.
Besides, Sandisk has created a Technical Advisory Council To ensure that all this development has the right approach. This council is composed of experts from the company itself and outside it, and its role will be Provide technical vision, strategic advice And above all, Work so that this technology does not stay on wet paper.
In short, this alliance between Sandisk and SK Hynix aims to solve one of the great bottlenecks faced by AI: memory. With more speed, greater capacity and tight prices, HBF is emerging as a key piece for new generations of artificial intelligence hardware.
